RESPONSIBILITIES * Define end-to-end thermal design across NPU/ASIC package → PCB → card (PCIe FHFL/HHHL, OAM, SXM) → system (server chassis) levels, selecting and designing heatsinks, heat pipes, vapor chambers, cold plates, and TIM * Evaluate trade-offs across cooling approaches — air, liquid, 2-phase, and immersion — and run CFD simulations (FloTHERM, Icepak) including EM-thermal co-simulation using power maps from HFSS/SIwave/PowerDC * Validate thermal performance through wind tunnel testing, hands-on temperature measurement (thermocouples, IR cameras, RTDs), and DOE-based simulation-to-measurement correlation * Support reliability testing including thermal cycling and burn-in * Partner with electrical, mechanical, and manufacturing teams to integrate thermal solutions into packaged hardware, and negotiate thermal specifications with OEM/ODM and hyperscale customers * Author thermal design guides, reference designs, and test reports, and ensure compliance with form-factor standards (OCP OAM, PCIe CEM, NVIDIA SXM, etc.) MINIMUM QUALIFICATIONS * Thermal Modeling & Simulation: Utilize computational fluid dynamics (CFD) to simulate heat transfer and fluid flow. * System Design: Design active and passive cooling solutions, including heatsinks, fans, liquid cooling coldplate. * Thermal Testing: Evaluation for NPU card thermal performance with using multi temp recorder and FLIR camera or thermocouples. * Collaboration: Work closely with electrical, mechanical, and manufacturing teams to integrate thermal solutions into packaged hardware. PREFERRED QUALIFICATIONS * Experienced GPU or NPU card development or server development for datacenter * Flotherm or Icepak preferred * English communication for business level * Positive and proactive engineer CONTACT * [email protected]