Die Attach Manufacturing Engineer- Process & Equiment

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Singapore Full-time Posted 30+ days ago

JOB DESCRIPTION We are seeking a Die Attach Manufacturing Engineer – Process & Equipment (Silicon Photonics / PIC Packaging) to join our Manufacturing Engineering team within Photonic Packaging & Assembly. In this mid-to-senior level role, you will lead the development, qualification, optimization, and sustaining of die attach processes and equipment for Photonic Integrated Circuits (PICs), silicon photonics dies, and co-packaged optical/electronic modules. This position is responsible for achieving sub-micron placement accuracy and optical-grade attach quality through active/passive…

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